l 2 5 2 0 1 0 1 r 0 m - (a) (b) (d) (b) dimension code (c) inductance code : 1r0 = 1.0uh (a) series code 2. configuration & dimensions : 4. materials : superworld electronics (s) pte ltd (a) body : ferrite (b) termination : ag/ni/sn a 3. schematic : (d) tolerance code : m = 20%, y = 30% 5. general specification : b) rated current : base on temp. rise a) temp. rise : 40c max. l252010 series ferrite chip inductors pg. 1 note : specifications subject to change without notice. please check our website for latest information. 13.10.2011 2.0 0.2 unit:m/m 2.5 0.2 a 1.0 max. c a d b 0.50 0.3 b ag(100%) ni(100%)-1.5um(min.) sn(100%)-3.0um(min.) c) storage temp. : -40c to +105c d) operating temp. : -40c to +105c e) resistance to solder heat : 260c.10secs (c) (e) internal controller number ( e ) b c d
superworld electronics (s) pte ltd ferrite chip inductors l252010 series note : specifications subject to change without notice. please check our website for latest information. pg. 2 13.10.2011 6. electrical characteristics : part number inductance (h) 6-1. inductance vs. frequency curve : 6-2 inductance-current curve : l2520101r0m- test frequency (mhz) rated current (ma) max dc resistance (
) srf (mhz) min 1.0 20% 1 1500 0.10 30% 90 l2520101r5m- 1.5 20% 1 1400 0.12 30% 60 l2520102r2m- 2.2 20% 1 1300 0.14 30% 50 l2520103r3m- 3.3 20% 1 1200 0.18 30% 40 l2520104r7m- 4.7 20% 1 1000 0.23 30% 35 L2520106R8M- 6.8 20% 1 900 0.25 30% 30 l252010100m- 10 20% 1 800 0.30 30% 20
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 3 13.10.2011 ferrite chip inductors l252010 series 7. reliability & test condition : bending 40(1.575) not be damaged by the forces applied on the the terminal electrode & the dielectric must flexture strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. test condition performance not be damaged by the forces applied on the the terminal electrode & the dielectric must more than 95% of the terminal electrode refer to standard electrical characteristics list 100.5 seconds 60 seconds terminal strength solderability right conditions. w should be covered with solder. 60 seconds preheating 245c 150c 4?1.0 seconds cooling dipping natural solder heat resistance temperature rise test operating temperature dc resistance inductance storage te mperature preheating 40c max. ( ? t) 260c 150c dipping cooling natural solder : sn-cu0.5 flux for lead free : rol0 dip time : 41sec. preheat : 150c, 60sec. solder temper ature : 2455c 2. temperature measured by digital surface thermometer. flux for lead free : rol0 dip time : 100.5sec. preheat : 150c, 60sec. solder : sn-cu0.5 solder temper ature : 2605c 1. applied the allowed dc current. hp4291, hp e4991+hp4287 +hp16192 hp4338 no mechanical damage remaining terminal electrode : 75% min. item 1.0 l252010 size force (kfg) time (sec) -40~+105c (including self-temperature rise) -40~+105c rated current appearance: no significant abnormality. inductance change: within 10%. long storage conditions, please see the aplication notice dc power supply, over rated current ,there will be some risk > 30 the duration of the applied forces shall be 60(+5) sec
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 4 13.10.2011 ferrite chip inductors l252010 series not be allowed. appearance : cracking, chipping & any other defects harmful to the characteristics should the ferrite should not be damaged by forces applied on the right condition. random vibration test bending st rength item 1.0(0.039) r0.5(0.02) mutually perpendicular direction.(total 9 hours) amplitude : 1.52mm frequency : 10-55-10hz for 15 min. directions & times : x, y, z directions for 15 mins this cycle shall be performed 12 times in each of three a performance test condition chip height of 75cm. drop 10 times on a concrete floor from a drop no mechanical damage appearance : no damage. inductance : within 10% of initial value. temperature life testing at high temperature humidity : 90~95% rh. temperature : 402c duration : 5048hrs duration : 100812hrs applied current : rated current temperature : 1052c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. humidity measured : 500 times appearance : no damage. phase inductance : within 10% of initial value. low temperature storage test thermal shock number of cycles : 500 step2 : +1055c 305 min. duration : 5008hrs temperature : -402c measured at room temperature after placing for 2 to 3hrs. measured at room temperature after placing for 2 to 3hrs. room temp -402c 2 1 <0.5 305 step1 : -402c 305 min. condition for 1 cycle temperature (c) times (min.) 7. reliability & test condition : mm (inches) size l252010 p-kgf appearance : no damage. inductance : within 30% of initial value. 1.40(0.055) 1.0 inductance: within30% inductance change : within10% +1052c 3 305
note : specifications subject to change without notice. please check our website for latest information. superworld electronics (s) pte ltd pg. 5 13.10.2011 ferrite chip inductors l252010 series 8. soldering and mounting : 8-1. recommended pc board pattern air soldering tools. 8-2.2 soldering iron (figure 2) : 8-2.1 lead free solder re-flow : wave and re-flow soldering systems. if hand soldering cannot be avoided, the preferred technique is the utilization of hot by the difference in coefficients of expansion between solder, ch ip and substrate. the terminations are suitable for all mildly activated rosin fluxes are preferred. the minimu m amount of solder can lead to damage from the stresses caused recommended temperature profiles for re-flow soldering in figure 1. products attachment with soldering iron is discouraged due to t he inherent process control limitations. in the event that a) preheat circuit and products to 150c. b) 350c tip temperature (max) c) never contact the ceramic with the iron tip a soldering iron must be employed the following precautions are recommended. note : 8-2. soldering 330 e) use a 20 watt soldering iron with tip diameter of 1.0mm f) limit soldering time to 4~5 secs. d) 1.0mm tip diameter (max) under mechanical stress as warping the board. the mechanical stress to prevent failure. products shall be positioned in the sideway direction against pc board should be designed so that products are not sufficient figure 2. hand soldering gradual cooling temperature c over 1min. 350 150 preheating soldering cooling natural (max.) 4~5 sec 1.5 3.9 1.5 figure 1. re-flow soldering (pb free) 480s max. 217 200 260 150 temperature c 25 reflow 3 times max. time (sec) 60~180s 60~150s 20 ~ 40s preheating soldering natural cooling
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 6 13.10.2011 ferrite chip inductors l252010 series 9. packaging information : may cause the failure of mechanical or electrical perform ance. solder shall be used not to be exceed as shown in fig. 4. accordingly increasing the solder volume, the mechanical st ress to product is also increased. exceeding solder volume figure 4 recommendable upper limit t 8-3. solder volume 9-1. reel dimension r0.5 r10.5 13.50.5 7" x 8mm d 9-2 tape dimension / 8mm b 7" x 8mm c 1 2 0 r1.9 20.5 a 178.02.0 b(mm) 60.02.0 90.5 a(mm) type 13.50.5 c(mm) d(mm) chip size reel 3000 l252010 9-3. packaging quantity 1.45 max ko(mm) l252010 size p(mm) 4.00.1 ao(mm) 2.290.10 bo(mm) t(mm) 0.3 max 2.740.10 material : plastic po:40.1 p p2:20.05 f:3.50.05 e:1.750.1 bo w:8.00.1 ao d1:10.1 a section a-a ko a d:1.5+0.1 t
superworld electronics (s) pte ltd note : specifications subject to change without notice. please check our website for latest information. pg. 7 13.10.2011 ferrite chip inductors l252010 series the force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 300 (mm/min) tearing speed room atm room temp. room humidity 2. transportation : a) products should be handled with care to avoid dam age or contamination from perspiration and skin oils. c) bulk handling should ensure that abra sion and mechanical shock are minimized. b) the use of tweezers or vacuum pick up is strongly recommended for individual components. c) the packaging material should be kept where no chlorine or sulfur exists in the air. application notice b) recommended products should be used within 6 months from the time of delivery. 1. storage conditions : a) temperature and humidity conditions : 40c and 70% rh. to maintain the solderabililty of terminal electrodes : top cover tape base tape (%) 45~85 (c) 5~35 860~1060 (hpa) 9-4. tearing off force 165 to 180 f
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